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High Density Packaging User Group Announces Shenzhen Kinwong Electronic Co., Ltd. Membership

05/20/2024 | High Density Packaging User Group
High Density Packaging User Group (HDP) is pleased to announce that Shenzhen Kinwong Electronic Co., Ltd. (Kinwong) has become a member. 

Real Time with… IPC APEX EXPO 2024: Modernizing a PCB Facility

05/13/2024 | Real Time with...IPC APEX EXPO
Aidan Salvi, chief transformation officer at Amitron, discusses modernizing the company's PCB facility including equipment selection, installation, process redefinition, staff upskilling, university engagement, and customer relationship building. Emphasizing that this is a significant endeavor not to be undertaken lightly, Aidan highlights the importance of focus, software technology use, and a step-by-step approach to modernization. He recommends caution when assessing whether to approach factory modernization as one big project or take a more measured approach to modernize in segments.

American Standard Circuits to Exhibit at Focus on PCB 2024 Italy

05/09/2024 | American Standard Circuits
American Standard Circuits will be exhibiting at this year’s Focus on PCB Italy 2024 to be held on May 15 and 16 at the Vicenza Expo Centre, Vicenza, Italy.

Real Time with… IPC APEX EXPO 2024: Direct Imaging Equipment and Quad-wave DLP Light Engine Technology

05/03/2024 | Real Time with...IPC APEX EXPO
Guest Editor Kelly Dack and MivaTek's Brendan Hogan delve into the company's innovative technologies, including direct imaging equipment and quad-wave DLP light engine technology. They highlight the benefits of direct imaging, compensation, and DART technology.

Real Time with… IPC APEX EXPO 2024: Operational Excellence and Smart Factory Initiatives

04/30/2024 | Real Time with...IPC APEX EXPO
Operational excellence and operational efficiency are defined in this interview with Koh Young General Manager Joel Scutchfield. He touches on automation, AI, and collaboration as solutions to resource limitations. Koh Young's data-driven approach uses AI for process adjustments, data analytics, and supply chain enhancements. The discussion underscores the shift toward smart factory initiatives and the future of manufacturing, with a focus on reshoring, nearshoring, and technology utilization.
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